Area of application
baufan Wood Glue D3 is suitable for gluing all commercially available types of wood, wood-based materials and laminates.
Preparation
Prepare the workpieces to be glued properly. The gluing surfaces must be clean and free of grease and dust. The ideal wood moisture content is 8-12 %. Higher humidity prolongs the setting time.
Processing
Apply baufan wood glue D3 on both sides with a brush or glue comb. The total application quantity should be 150 - 200 g/m². After the shortest possible flash-off time, press the parts to be joined together while still damp. The pressing pressure should be approx. 1 N/mm² and should be maintained for approx. 15 minutes. For laminate boards, the pressing pressure can be increased to 3 N/mm² and the pressing time to 30 minutes. When laying pre-finished parquet or laminate flooring, apply baufan Wood Glue D3 in strands on both sides of the tongue, push the flooring elements together and tap them together. Immediately wipe away any excess glue with a damp cloth. Always observe the adhesive guidelines of the flooring manufacturer. Clean tools with water immediately after use.
Consumption
depending on the substrate ► from 150 - 200 g/m²
Storage
Keep container tightly closed in a cool but frost-free place. If unopened and stored properly, shelf life is at least until: see batch label.
Notes
Processing temperature: at least + 5 °C for material and circulating air The drying time depends on the processing temperature. Relative humidity above 90%, especially in conjunction with low temperatures, can significantly affect the drying time and quality properties. GISBAU - GISCODE for installation materials: D1 Waste code no. 080410. Only empty containers should be sent for recycling. Dried material residues can be disposed of according to waste code no. 080410 (waste adhesives and sealants with the exception of those falling under 080409) or 170904 (mixed construction and demolition waste with the exception of those falling under 170901, 170902 and 170903) or as household waste.