Area of application
Universeller Kontaktklebstoff mit hoher Festigkeit für Teppich, Kork, Styropor® und Holzleisten auf Holz, Stein und Metall.
Preparation
Mineral substrates, V100 chipboard, OSB boards, wood, parquet, laminate, linoleum, metal and similar substrates are suitable. The substrate must be dry, sound, clean and even. Remove wax, grease, dirt, dust and other contaminants. Prime highly absorbent, sanding and chalking substrates - e.g. with Tiefengrund LF or Putz- und Haftgrund. Level rough and uneven floor surfaces with floor levelling compound. The coverings to be bonded must be conditioned, relaxed and levelled.
Processing
Apply contact adhesive to both sides of the substrate and the material to be bonded using a short-pile roller or brush to create a closed film. Allow the contact adhesive to flash off until it has dried transparently (approx. 30 - 90 minutes depending on the covering and substrate). Then lay the covering in the correct position and press down firmly, first in the seam area and then over the entire surface. It is essential that the flooring is laid accurately, as it is no longer possible to correct it once the two layers of adhesive have come into contact. Work on large areas in sections, as the flooring can be laid for a maximum of 2 hours after the adhesive has dried transparently. The bonded floor coverings can be walked on immediately and are fully load-bearing after one day. Surface treatment after 24 hours at the earliest.
Consumption
Approx. 250 g/m² for double-sided application
Storage
Keep container tightly closed and store in a cool but frost-free place. Keep out of the reach of children.
Notes
Not suitable for bonding PVC. The installation guidelines of the flooring manufacturer must be observed. Do not use below +15 °C object and room temperature or above n75 % humidity. Remove adhesive residues immediately with water. Clean tools with water immediately after use. Dried material residues can be disposed of with household waste or construction site waste. Dispose of uncured residues according to EWC waste code no. 08 04 10.
International 